Lntech SNQ-3581F-M HD-SDI/CVBS Camera Module Split Architecture EN781F+IMX385

The Lntech SNQ-3581F-M is an engineering solution for OEMs and integrators facing significant spatial constraints or requiring unique form factors. It decomposes the traditional camera module into two interconnected PCBs:

1. Sensor Board: A minimal 25mm diameter circular PCB dedicated solely to the Sony IMX385 1/1.8-inch CMOS image sensor and its immediate support components.

2. Main Board: A 25mm x 52mm rectangular PCB hosting the EN781F 4K-capable digital signal processor, power regulation, output interfaces (HD-SDI/EX-SDI via SMA connector and CVBS), and control circuitry.

These boards are connected by a flexible ribbon cable, allowing them to be positioned independently within a product. This architecture provides unparalleled freedom for mechanical design, thermal management, and maintenance while delivering high-performance 1080p60 video with starlight-level low-light capability.

1. Modular Architecture Advantages
The separation of functions offers distinct engineering benefits:

• Mechanical Design Freedom: The sensor head can be placed optimally for the optical path, regardless of where there is space for the larger main board. This is critical in products like drones, automotive mirror assemblies, and compact medical devices.

• Improved Signal Integrity: The short, dedicated connection between the sensor and its associated components on a small board can reduce noise. The main board handles noisier digital and power circuits separately.

• Thermal Decoupling: The heat-generating DSP and power regulators are isolated from the temperature-sensitive image sensor, preventing heat from degrading image quality.

• Serviceability: Either board can be replaced independently in the field, reducing repair costs and downtime.

2. Performance Specifications
Despite its split nature, the module does not compromise on performance:

• Resolution & Speed: Supports full 1080p resolution at 60fps.

• Sensitivity: Leverages the IMX385 sensor and DSS technology to achieve an extremely low 0.000008 Lux illumination level.

• Output Flexibility: Provides both professional 3G-SDI for long-distance digital transmission and legacy CVBS analog output.

• Processing Features: The EN781F DSP enables advanced WDR, Defog, and 3D-DNR.

3. Integration Considerations

• Interconnect: The flexible cable between boards is a critical component. Its length, flexibility, and shielding must be specified for the application.

• Housing Design: Requires a custom housing designed to secure both boards and manage the cable routing.

• Lens Selection: The sensor board uses a standard M12 lens mount.